Manufacturer:
Comair Rotron
Description:
HEATSINK STAMP 19.4X25.4X11.4MM
Detailed Description:
Heat Sink TO-263 (D²Pak) Copper 1.5W @ 20°C Board Level
Product Status::
7906 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | SMD Pad |
Diameter | - |
Fin Height | 0.450" (11.43mm) |
Length | 0.763" (19.38mm) |
Material | Copper |
Material Finish | Tin |
Mfr | Comair Rotron |
Package | Bulk |
Package Cooled | TO-263 (D²Pak) |
Power Dissipation @ Temperature Rise | 1.5W @ 20°C |
Product Status | Obsolete |
Series | - |
Shape | Rectangular, Fins |
Thermal Resistance @ Forced Air Flow | 4.00°C/W @ 200 LFM |
Thermal Resistance @ Natural | - |
Type | Board Level |
Width | 1.000" (25.40mm) |
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