Manufacturer:
Chip Quik Inc.
Description:
SMOOTH FLOW LOW TEMP SOLDER PAST
Detailed Description:
No-Clean Solder Paste Bi57Sn42Ag1 (57/42/1) Jar, 1.76 oz (50g)
Product Status::
3141 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | NC191 |
Composition | Bi57Sn42Ag1 (57/42/1) |
Diameter | - |
Flux Type | No-Clean |
Form | Jar, 1.76 oz (50g) |
Melting Point | 279°F (137°C) |
Mesh Type | 5 |
Mfr | Chip Quik Inc. |
Package | Bulk |
Process | - |
Product Status | Active |
Series | Smooth Flow™ |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
Type | Solder Paste |
Wire Gauge | - |
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