Manufacturer:
Aavid, Thermal Division of Boyd Corporation
Description:
BOARD LEVEL HEAT SINK
Detailed Description:
Heat Sink BGA Aluminum 1.0W @ 40°C Board Level
Product Status::
2491 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | Thermal Tape, Adhesive (Not Included) |
Diameter | - |
Fin Height | 0.155" (3.94mm) |
Length | 0.790" (20.07mm) |
Material | Aluminum |
Material Finish | Black Anodized |
Mfr | Aavid, Thermal Division of Boyd Corporation |
Package | Bulk |
Package Cooled | BGA |
Power Dissipation @ Temperature Rise | 1.0W @ 40°C |
Product Status | Active |
Series | - |
Shape | Square |
Thermal Resistance @ Forced Air Flow | 20.00°C/W @ 200 LFM |
Thermal Resistance @ Natural | - |
Type | Board Level |
Width | 0.790" (20.07mm) |