Manufacturer:
Aavid, Thermal Division of Boyd Corporation
Description:
BOARD LEVEL HEAT SINK
Detailed Description:
Heat Sink BGA Aluminum 1.5W @ 40°C Board Level
Product Status::
2496 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | Thermal Tape, Adhesive (Not Included) |
Diameter | 0.300" (7.62mm) ID, 1.125" (28.57mm) OD |
Fin Height | - |
Length | - |
Material | Aluminum |
Material Finish | Black Anodized |
Mfr | Aavid, Thermal Division of Boyd Corporation |
Package | Bulk |
Package Cooled | BGA |
Power Dissipation @ Temperature Rise | 1.5W @ 40°C |
Product Status | Active |
Series | - |
Shape | Cylindrical |
Thermal Resistance @ Forced Air Flow | 8.00°C/W @ 400 LFM |
Thermal Resistance @ Natural | - |
Type | Board Level |
Width | - |