Manufacturer:
Aavid, Thermal Division of Boyd Corporation
Description:
BOARD LEVEL HEAT SINK
Detailed Description:
Heat Sink TO-268 (D³Pak) 1.0W @ 20°C Top Mount
Product Status::
2555 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | SMD Pad |
Base Product Number | 573400 |
Diameter | - |
Fin Height | 0.401" (10.20mm) |
Length | 0.500" (12.70mm) |
Material | - |
Material Finish | Tin |
Mfr | Aavid, Thermal Division of Boyd Corporation |
Package | Bulk |
Package Cooled | TO-268 (D³Pak) |
Power Dissipation @ Temperature Rise | 1.0W @ 20°C |
Product Status | Active |
Series | - |
Shape | Rectangular, Fins |
Thermal Resistance @ Forced Air Flow | 4.00°C/W @ 600 LFM |
Thermal Resistance @ Natural | 14.00°C/W |
Type | Top Mount |
Width | 1.220" (30.99mm) |
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