Manufacturer:
Kester Solder
Description:
SOLDER 500G JAR,SN96.5 AG3.0
Detailed Description:
Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)
Product Status::
5585 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Base Product Number | 70-1903 |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Flux Type | Water Soluble |
Form | Jar, 17.64 oz (500g) |
Melting Point | 423 ~ 424°F (217 ~ 218°C) |
Mesh Type | 3 |
Mfr | Kester Solder |
Package | Jar |
Process | Lead Free |
Product Status | Active |
Series | R520A |
Shelf Life | 4 Months |
Shelf Life Start | Date of Manufacture |
Shipping Info | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
Storage/Refrigeration Temperature | 32°F ~ 50°F (0°C ~ 10°C) |
Type | Solder Paste |
Weight | 1.1 lbs (499 g) |
Wire Gauge | - |
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