Manufacturer:
Harimatec Inc.
Description:
97SC 400 2% 0.38 DIA
Detailed Description:
Lead Free No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 27 AWG, 28 SWG Spool, 8.8 oz (250g)
Product Status::
19785 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | 0.015" (0.38mm) |
Digi-Key Storage | - |
Flux Type | No-Clean |
Form | Spool, 8.8 oz (250g) |
Melting Point | 423°F (217°C) |
Mfr | Harimatec Inc. |
Package | Bulk |
Process | Lead Free |
Product Status | Active |
Series | C400 |
Shelf Life | - |
Shelf Life Start | - |
Shipping Info | - |
Storage/Refrigeration Temperature | - |
Type | Wire Solder |
Weight | - |
Wire Gauge | 27 AWG, 28 SWG |
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