Manufacturer:
Aavid, Thermal Division of Boyd Corporation
Description:
HEATSINK BGA W/ADHESIVE TAPE
Detailed Description:
Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
Product Status::
3320 In Stock
Data Sheet:
PCB Symbol, Footprint
& 3D Model:
Quantity:
Attribute | Attribute Value |
---|---|
Attachment Method | Thermal Tape, Adhesive (Included) |
Base Product Number | 374324 |
Diameter | - |
Fin Height | 0.394" (10.00mm) |
Length | 1.063" (27.00mm) |
Material | Aluminum |
Material Finish | Black Anodized |
Mfr | Aavid, Thermal Division of Boyd Corporation |
Package | Box |
Package Cooled | BGA, FPGA |
Power Dissipation @ Temperature Rise | 3.0W @ 90°C |
Product Status | Active |
Series | 37432 |
Shape | Square, Pin Fins |
Shelf Life | - |
Thermal Resistance @ Forced Air Flow | 9.30°C/W @ 200 LFM |
Thermal Resistance @ Natural | 30.60°C/W |
Type | Board Level |
Width | 1.063" (27.00mm) |